Passive and Active Co-Design, Antennain- Package, On-Chip Antenna and 3D Printing Technology for MmWave and THz Applications

Author(s): Bing ZHANG
Source: FERMAT, Volume 23, Communication 1, Sep.-Oct., 2017


Abstract: We introduce two co-designs of RF passive and active devices. By co-designing a 1.2 GHz oscillator with bandpass filters, the phase noise and harmonic suppression are improved. By co-designing a 220 GHz on-chip antenna with reflection amplifiers and driving amplifiers, the radiated power is enhanced. Then a historical review as well as outlook of the popular processes to implement antennas for mmWave and THz applications are given. Investigations go into the aspects of design, process and packaging. Great cost reduction is achieved when the Low Temperature Co-fired Ceramic (LTCC) process is replaced by the Liquid Crystal Polymer (LCP), while equal performance remains. Methods to overcome the intrinsic drawbacks of both the materials are discussed. Successful demonstrations are made up to 145 GHz of both LTCC and LCP packaged antennas. The 3D printing technology is eye-catching nowadays, while most focuses are on the non-metallic 3D printing technique. Here, we, for the first time, manage with successful demonstration to implement antennas by metallic 3D printing technology up to the H-band (220-325 GHz). Information are given on the design precautions and process-related surface roughness of the 3D printed antennas.

Index Terms: Antenna-in-package, Antenna-on-chip, LTCC, LCP, Co-design, 3D printing, MmWave, THz.


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Passive and Active Co-Design, Antennain- Package, On-Chip Antenna and 3D Printing Technology for MmWave and THz Applications









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